See a live demo of the NEW Creaform HandySCAN BLACK and Go!SCAN SPARK – the Ultimate Reference in Portable MetrologyMany companies are looking to expand their“non-contact” inspection and reverse engineering capabilities.This workshop will feature new 3D scanning solutions by Creaform.
Join us in Boston for the IEEE MTT International Microwave Symposium covering all aspects of microwave theory and practice. The week-long conference includes technical paper presentations, workshops, tutorials as well as social events and networking opportunities.
Join Adaptive at Rapid + TCT – North America’s premiere event for discovery, innovation and networking in 3D manufacturing.
This week Creaform introduced 2 new products to help drive innovation in your product lifecycle: the HandySCAN Black and the new Go!SCAN Spark.
Analytical simulation is a powerful tool that can allow for understanding the dynamic behavior and fatigue life of any structure. However, one of the most challenging tasks involved with developing a simulation is developing accurate and realistic load cases, which replicate field strains in the structure, so that it may be used for validation.