Michelle Anderson, Author at Adaptive Corp

Author: Michelle Anderson

17 May 2019

3D Scanning Lunch & Learn Workshops: Non-Contact Inspection with Metrology-Grade 3D Scanning

See a live demo of the NEW Creaform HandySCAN BLACK and Go!SCAN SPARK – the Ultimate Reference in Portable Metrology

Many companies are looking to expand their“non-contact” inspection and reverse engineering capabilities.

This workshop will feature new 3D scanning solutions by Creaform.

If you are an Automotive or Aerospace Supplier, this event will be of interest to you.

We will address the Inspection process from:

  • First Article Inspection (FAI) – for PPAP and AS9102
  • Hybrid Inspection – using 3D scanning to compliment CMM thereby improving throughput in QA
  • High Resolution/High Speed Metrology Grade 3D Scanning demonstrations featuring Creaform’s newest 3D scanning products:
                        HandySCAN BLACK
                        Go!SCAN SPARK
  • Presentations by PolyWorks USA – learn what’s new in the latest version of PolyWorks II
  • Using 3D printing to create CMM fixtures


June 4th
Embassy Suites (Cleveland Area)
5800 Rockside Woods Boulevard N
Independence, OH 44131

June 7th
Honda Heritage Center (Columbus Area)
24025 Honda Parkway
Marysville, OH 43040



30 Apr 2019

Visit Adaptive at Booth #893 at the International Microwave Symposium

June 2-7
Boston Convention & Exhibition Center

Visit us at booth #893.

Join us in Boston for the IEEE MTT International Microwave Symposium covering all aspects of microwave theory and practice.  Adaptive will be demonstrating the power of SIMULIA on the 3DEXPERIENCE Platform.  SIMULIA is a portfolio of simulation tools to help optimize the complex design of parts and boards for electronic and microwave components, materials analysis and more.  Applications in the SIMULIA portfolio enable engineers to test performance, reliability, and safety of materials and products while still in the virtual environment, saving time and money by reducing or eliminating physical prototypes.  

Our specialty toolset for microwave electronics applications includes two new product offerings on the 3DEXPERIENCE platform:

CST Studio Suite®, a high-performance 3D electromagnetic (EM) analysis software package, meets design, analysis, and optimization needs for EM components and systems. EM analysis is commonly used to examine questions such as electro-mechanical effects in motors and generators, thermal effects in high-power devices, exposure of the human body to EM fields, and electromagnetic compatibility and interference (EMC/EMI), among other uses.

Wave 6 – The next-generation vibro- and aero-vibro-acoustic simulation tool which offers a wide variety of industry application simulations and unique analysis methods that efficiently and accurately simulate noise and vibration across the audible frequency range.

About the Conference

The week-long conference includes technical paper presentations, workshops, tutorials as well as social events and networking opportunities. 

Some of this year’s highlights include:

  • IMS Three Minute Thesis (#MT) Competition
  • a 5G Summit showcasing next-generation wireless technologies
  • RF Boot Camp – a three-day course on RL/microwave
  • Industry workshops including:
    • Microwave Materials: Enabling the Future of Wireless Communication
    • 5G mm-Wave to sub-THz Circuit and System Techniques
    • Quantum Computing for RFIC Engineers: Concepts, Devices, Systems, and Opportunities
    • Fundamental of mm-wave IC design in CMOS
    • State-of-the-art RF Receivers: Leading Edge Industrial Architectures and New Systems on the Horizon
  • Networking events
  • Student Design, Student Paper, Industry Paper, and Advanced Practice Paper Competitions
  • Project Connect for under-represented minority engineering students, and the PHD Student Initiative for new PhD students

The Plenary session on Monday, June 3, features Dr. William Chappell, Director of the Microsystems Technology Office (MTO), Defense Advanced Research Projects Agency (DARPA) who will speak on “The Mind and Body of Intelligent RF.”

Find out more and register today


30 Apr 2019

Visit Adaptive at Rapid + TCT Booth 2227

May 20 – May 23
Cobo Center
Detroit, MI

Join Adaptive at Rapid + TCT – North America’s premiere event for discovery, innovation and networking in 3D manufacturing. 

Visit us at booth 2227.

Be here for some of the biggest product announcements of the year, see the latest applications and hear from experts about where the industry is headed next. 

Keynote presentations include:

  • Carbon and Riddell: Bringing Innovation to Head Protection
  • Disruptive Technology and Innovation
  • Additive Manufacturing: Leveraging Design Capabilities for Production of Devices that Make Healthcare Better
  • Shaping New Ways for Smart Automotive Production by Using AM

Need more reasons to attend?

  1. Learn how to use 3D technologies to reduce time to market, produce stronger and lighter parts, improve efficiency, reduce waste, and create complex geometries
  2. Consult with industry experts before you make equipment decisions
  3. Visit 300+ 3D technology providers in one room and see groundbreaking product launches
  4. Network with the most experienced and influential community in 3D manufacturing and see how they’re addressing challenges
  5. Discover the latest processes, applications, materials, and research in additive manufacturing at the conference, with over 150 presentations

Get a Free Pass to the Exhibits

Get a Free Pass today with our special promotion code 15228136 with this registration link:


Learn more about RAPID + TCT today

26 Apr 2019

Adaptive’s Cynde Murphy to Speak at V&V Symposium

V&V Verification and Validation Symposium
Conference May 15-17
Training & Committee Meetings May 13-14
Westgate Resorts, Las Vegas, Nevada

Dynamic Load and Weld Fatigue Calculation for Validation of a Telescoping Boom Chassis presented by:

Adaptive’s Cynde Murphy, Simulation and Services Manager
Bob LeGrande, Engineer Principal III, Terex Corp., AWP Division – Genie Industries
Kyle Roark, Engineer Principal II, Terex Corp, AWP Division – Genie Industries

Analytical simulation is a powerful tool that can allow for understanding the dynamic behavior and fatigue life of any structure. However, one of the most challenging tasks involved with developing a simulation is developing accurate and realistic load cases, which replicate field strains in the structure, so that it may be used for validation. Once a representative finite element model (FEM) of a structure is created, challenges arise when understanding and applying dynamic loads to the FEM so that correlation and validation with physical testing is accurate. One step further in complexity is being able to calculate dynamic stress profiles for the entire structure, and use those results for further investigation, in this case fatigue estimates.

Historically, analysts have had to rely on expensive prototyping and time-consuming full vehicle measurements, even within the iterations of one design concept. Analyze-Build-Test is quickly becoming a thing of the past, as product development companies strive for quick to market designs. Simulation experts at Adaptive Corporation, in conjunction with Terex, were able to circumvent this traditionally laborious process and develop an efficient and accurate validation process. Our team has leveraged the use of ANSA, ABAQUS, Wolf Star Technologies True-Load™ software and Fe-Safe, to develop an FEM, understand the dynamic mechanical loads and develop a duty cycle for the Terex telescoping boom chassis. This body of work can and will be subsequently used for design, simulation, fatigue analysis, validation and engineering development of iterations of the same chassis structure, as well as similar chassis designs.

The general steps of the process are as follows: FEM Creation of Assembly FEM of the chassis structure was created using ANSA pre-processor software. Instrumentation and Data Acquisition To successfully calculate mechanical loads acting on the Terex Telescoping Boom Chassis for the FEM, accurate strain measurements were required. Using the FEM and the Wolf Star Technologies True-Load™ software, optimal strain gages placement was identified and installed on a test chassis. Strain gage time history data for various proving ground events, such as cornering, washboard, curbs and potholes. Load Calculation and Development Using the time history data for the optimal map of strain gages, the FEM and True-Load™ software, equivalent (dynamic) unit loads were calculated. Fatigue Analysis Using dynamic stress results from the FEM, given a duty cycle that included a combination of various proving ground events, fatigue life estimates of the Terex Telescoping Boom Chassis and critical welds were calculated. Calculating the mechanical loads for this project allows Terex the ability to rapidly iterate on designs for this chassis, as well as provide a starting point for other similar chassis designs. This ultimately saves time and money in their product development cycle by reducing the efforts of traditional design-build-test cycle, by means of “virtual validation.”

If you aren’t able to attend the V&V Verification and Validation Symposium tune in to our on demand webinar: Dynamic Load Calculation and Correlation of an Aluminum Truck Body,” also presented by Cynde Murphy.

24 Apr 2019

Introducing Nylon White for Markforged 3D Printers

Announcing Nylon White composite material available for the Mark Two and X7 Markforged 3D Printers.

It is now possible to print in Nylon and Onyx on the same printhead! But what is Nylon White?

  • Nylon White is an engineering thermoplastic that is non-abrasive and can be easily painted.
  • It replaces Tough Nylon, which will no longer be available for purchase after mid-July 2019

Nylon White is better than what came before in every way – including being more easily printable, stronger and stiffer, non-abrasive, even more moisture resistant, and smoother.

It is available to purchase right now – just give us a call.

When should you use Nylon White?

  • When you need to customize any part that needs to be smooth and non-abrasive that will come into contact with Class A cosmetic surfaces.
  • When you need to easily paint or dye any parts to enhance designs, color code, or increase visibility.

Nylon White FAQ

  • Is Nylon food safe?
    • The base material is food safe, but we have not certified the overall process (spooling the filament through printing it) as food safe
  • What layer heights are supported?
    • Same as layer heights supported for Tough Nylon today.
      • Non-reinforced: 100 μm or 200 μm
      • Reinforced: default to 100 μm (HSHT, Kevlar, Fiberglass) and 125 μm (Carbon Fiber)
  • Which printers print Nylon White?
    • X7 and Mark Two print Nylon White.
  • Will you come out with more colors?
    • Yes, we plan to in the future.