Visit Adaptive at Booth #893 at the International Microwave Symposium
Boston Convention & Exhibition Center
Visit us at booth #893.
Join us in Boston for the IEEE MTT International Microwave Symposium covering all aspects of microwave theory and practice. Adaptive will be demonstrating the power of SIMULIA on the 3DEXPERIENCE Platform. SIMULIA is a portfolio of simulation tools to help optimize the complex design of parts and boards for electronic and microwave components, materials analysis and more. Applications in the SIMULIA portfolio enable engineers to test performance, reliability, and safety of materials and products while still in the virtual environment, saving time and money by reducing or eliminating physical prototypes.
Our specialty toolset for microwave electronics applications includes two new product offerings on the 3DEXPERIENCE platform:
CST Studio Suite®, a high-performance 3D electromagnetic (EM) analysis software package, meets design, analysis, and optimization needs for EM components and systems. EM analysis is commonly used to examine questions such as electro-mechanical effects in motors and generators, thermal effects in high-power devices, exposure of the human body to EM fields, and electromagnetic compatibility and interference (EMC/EMI), among other uses.
Wave 6 – The next-generation vibro- and aero-vibro-acoustic simulation tool which offers a wide variety of industry application simulations and unique analysis methods that efficiently and accurately simulate noise and vibration across the audible frequency range.
About the Conference
The week-long conference includes technical paper presentations, workshops, tutorials as well as social events and networking opportunities.
Some of this year’s highlights include:
- IMS Three Minute Thesis (#MT) Competition
- a 5G Summit showcasing next-generation wireless technologies
- RF Boot Camp – a three-day course on RL/microwave
- Industry workshops including:
- Microwave Materials: Enabling the Future of Wireless Communication
- 5G mm-Wave to sub-THz Circuit and System Techniques
- Quantum Computing for RFIC Engineers: Concepts, Devices, Systems, and Opportunities
- Fundamental of mm-wave IC design in CMOS
- State-of-the-art RF Receivers: Leading Edge Industrial Architectures and New Systems on the Horizon
- Networking events
- Student Design, Student Paper, Industry Paper, and Advanced Practice Paper Competitions
- Project Connect for under-represented minority engineering students, and the PHD Student Initiative for new PhD students
The Plenary session on Monday, June 3, features Dr. William Chappell, Director of the Microsystems Technology Office (MTO), Defense Advanced Research Projects Agency (DARPA) who will speak on “The Mind and Body of Intelligent RF.”