Join us at Thermal LIVE Summit on May 10th to learn how to predict electronic failures using Thermal Simulation
Studies show that runaway heat causes more than 50% of all electronic system failures. To prevent this phenomenon, design can include aspects such as thermal vias and airflow. Before building these systems, it can prove useful to virtually prototype the thermal design by using detailed simulation.
Shown in this presentation are case studies, including:
- Thermal vias for a RF termination,
- A board housed in an ARINC 600 Enclosure, and
- A cell phone with multiple thermal contributions
The thermal vias results are compared theoretically, experimentally, and virtually with simulation. A thermal imaging system using an IR camera was used to measure the top surface temperatures over a range of input powers with samples of varying via sizes and densities. The set-up was also examined theoretically and simulated for comparison. The current density from the radiator element was modeled and used as a source in a steady-state Thermal simulation. An ARINC enclosure was simulated with an CHT solver with airflow and various vent sizes. Lastly, a cell phone design is simulated to capture its electrical loss which is then seamlessly simulated for detailed thermal loss with additional thermal sources.
